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- Select a categories
- LCD Module Production Equipment
- Encapsulation Module Manufacturing Equipment
- High-speed SMT Module Equipment
- Audio-Video Module Equipment
- Automation Upgrade Equipment
- EV Charging Electronic Equipment
- Electronic Devices Related to Power Bank
Key Features
l Pre-Pressing + Main Pressing Dual-Station Design——Integrated pre-pressing and main pressing functions in one equipment platform, streamlining the production workflow from temporary positioning to permanent bonding .
l High-Precision CCD Vision Alignment System——Equipped with high-resolution cameras for precise IC-to-glass or FPC-to-glass alignment. Vision system captures images and calculates offset, achieving alignment accuracy of ±5μm (FOG) to ±2μm (COG) .
l Precise Temperature Control System Utilizes——high-precision temperature controllers with PID auto-tuning functionality. Supports both pulse heating (for rapid temperature rise and fall) and constant temperature heating modes, temperature range RT~499℃ with accuracy up to ±3℃ .
l High-Rigidity Press Head Structure——Adopts a 1-to-1 single press head design with high-rigidity construction, minimizing pressure stress and ensuring uniform pressure distribution across the bonding area .
l Intelligent Control Interface——Features PLC control with full-color touchscreen HMI, allowing easy parameter setting, real-time temperature curve display, and multi-program storage for different product specifications .
Technical Parameters
l Applicable Products LCD, TFT-LCD, OLED, Touch Panel (1.44" – 15.6")
l Bonding Accuracy ±0.025mm (25μm) – ±0.007mm (7μm)
l Temperature Range RT – 499℃ (adjustable)
l Temperature Control Accuracy ±3℃
l Pressure Range 3 – 40 Kgf
l Heating Method Pulse heating / Constant temperature heating
l Power Supply AC 220V 50/60Hz
l Air Pressure 0.4 – 0.8 MPa